HAMMOND – Purdue University Calumet’s mechatronics engineering technology program has received a $613,862 grant from the National Science Foundation.
Purdue Calumet is working in partnership with College of DuPage in Illinois and Ivy Tech Community College, along with the packing industry to develop new methods of packaging.
The mechatronics engineering technology program works on designing and building high speed machinery used in the package industry. The program was introduced at Purdue Calumet two years ago.
